Part 231 — Clawbacks of Chips Funding
Subpart A — Definitions
- § 231.101— Existing facility.
- § 231.102— Foreign country of concern.
- § 231.103— Foreign entity.
- § 231.104— Foreign entity of concern.
- § 231.105— Joint research.
- § 231.106— Knowingly.
- § 231.107— Legacy semiconductor.
- § 231.108— Material expansion.
- § 231.109— Members of the affiliated group.
- § 231.110— Person.
- § 231.111— Predominately serves the market.
- § 231.112— Required agreement.
- § 231.113— Research and development.
- § 231.114— Secretary.
- § 231.115— Semiconductor.
- § 231.116— Semiconductor manufacturing.
- § 231.117— Semiconductor manufacturing capacity.
- § 231.118— Semiconductors critical to national security.
- § 231.119— Significant renovations.
- § 231.120— Technology licensing.
- § 231.121— Technology or product that raises national security concerns.
Subpart B — General
- § 231.201— Scope.
- § 231.202— Prohibition on certain expansion transactions. (Expansion Clawback)
- § 231.203— Prohibition on certain joint research or technology licensing. (Technology Clawback)
- § 231.204— Additional conditions on certain joint research or technology licensing.
- § 231.205— Retention of records.
Subpart C — Notification, Review, and Recovery
- § 231.301— Procedures for notifying the Secretary of significant transactions.
- § 231.302— Contents of notifications; certifications.
- § 231.303— Response to notifications.
- § 231.304— Initiation of review.
- § 231.305— Procedures for review.
- § 231.306— Mitigation of national security risks.
- § 231.307— Review of actions that may violate the prohibition on certain joint research or technology licensing.
- § 231.308— Recovery and other remedies.