Part 413 — Electroplating Point Source Category

• § 413.01— Applicability and compliance dates.
• § 413.02— General definitions.
• § 413.03— Monitoring requirements.
• § 413.04— Standards for integrated facilities.

Subpart A — Electroplating of Common Metals Subcategory

• § 413.10— Applicability: Description of the electroplating of common metals subcategory.
• § 413.11— Specialized definitions.
• § 413.14— Pretreatment standards for existing sources.

Subpart B — Electroplating of Precious Metals Subcategory

• § 413.20— Applicability: Description of the electroplating of precious metals subcategory.
• § 413.21— Specialized definitions.
• § 413.24— Pretreatment standards for existing sources.

Subpart D — Anodizing Subcategory

• § 413.40— Applicability: Description of the anodizing subcategory.
• § 413.41— Specialized definitions.
• § 413.44— Pretreatment standards for existing sources.

Subpart E — Coatings Subcategory

• § 413.50— Applicability: Description of the coatings subcategory.
• § 413.51— Specialized definitions.
• § 413.54— Pretreatment standards for existing sources.

Subpart F — Chemical Etching and Milling Subcategory

• § 413.60— Applicability: Description of the chemical etching and milling subcategory.
• § 413.61— Specialized definitions.
• § 413.64— Pretreatment standards for existing sources.

Subpart G — Electroless Plating Subcategory

• § 413.70— Applicability: Description of the electroless plating subcategory.
• § 413.71— Specialized definitions.
• § 413.74— Pretreatment standards for existing sources.

Subpart H — Printed Circuit Board Subcategory

• § 413.80— Applicability: Description of the printed circuit board subcategory.
• § 413.81— Specialized definitions.
• § 413.84— Pretreatment standards for existing sources.