StacksVerified U.S. regulatory reference

40 CFR Part 98, Table I-19

Verified against eCFR.gov as of June 20, 2026View official text on eCFR.gov
Process type/sub-typeProcess gas i
CF4C2 F6 | CHF3 | CH2 F2 | C2 HF5 | CH3 F | C3 F8 | C4 F8 | NF3 | SF6 | C4 F6 | C5 F8 | C4 F8 O

Etching/Wafer Cleaning

1-Ui0.730.460.310.370.0640.66NA0.210.20.550.0860.072NA
BCF4NA0.20.10.0310.077NANA0.170.0040.0230.0089NANA
BC2 F60.029NANANANANANA0.065NANA0.0450.014NA
BC4 F6NANANANANANANANANANANANANA
BC4 F8NANANANANANANANANANANANANA
BC3 F8NANANANANANANANANANANANANA
BC5 F8NANANANANANANA0.016NANANANANA
BCHF30.13NANANANANANANANANANA0.0039NA

Chamber Cleaning

In situ plasma cleaning

1-Ui0.920.55NANANANA0.40.10.18NANANA0.14
BCF4NA0.19NANANANA0.20.110.14NANANA0.13
BC2 F6NANANANANANANANANANANANA0.045
BC3 F8NANANANANANANANANANANANANA

Remote plasma cleaning

1-UiNANANANANANANANA0.028NANANANA
BCF4NANANANANANANANA0.015NANANANA
BC2 F6NANANANANANANANANANANANANA
BC3 F8NANANANANANANANANANANANANA

In situ thermal cleaning

1-UiNANANANANANANANANANANANANA
BCF4NANANANANANANANANANANANANA
BC2 F6NANANANANANANANANANANANANA
BC3 F8NANANANANANANANANANANANANA

[89 FR 31923, Apr. 25, 2024]