40 CFR Table I-5 to Subpart I of Part 98
Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for MEMS Manufacturing
June 9, 2020
Open Table
| Process type factors | Process gas i | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| CF4 | C2F6 | CHF3 | CH2F2 | C3F8 | c− C4F8 | NF3 Remote |
NF3 | SF6 | C4F6a | C5F8a | C4F8Oa | |
| Etch 1-Ui | 0.7 | 10.4 | 10.4 | 10.06 | NA | 10.2 | NA | 0.2 | 0.2 | 0.1 | 0.2 | NA |
| Etch BCF4 | NA | 10.4 | 10.07 | 10.08 | NA | 0.2 | NA | NA | NA | 10.3 | 0.2 | NA |
| Etch BC2F6 | NA | NA | NA | NA | NA | 0.2 | NA | NA | NA | 10.2 | 0.2 | NA |
| CVD Chamber Cleaning 1-Ui | 0.9 | 0.6 | NA | NA | 0.4 | 0.1 | 0.02 | 0.2 | NA | NA | 0.1 | 0.1 |
| CVD Chamber Cleaning BCF4 | NA | 0.1 | NA | NA | 0.1 | 0.1 | 20.02 | 20.1 | NA | NA | 0.1 | 0.1 |
| CVD Chamber Cleaning BC3F8 | NA | NA | NA | NA | NA | NA | NA | NA | NA | NA | NA | 0.4 |
Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-type or process type.
1Estimate includes multi-gas etch processes.
2Estimate reflects presence of low-k, carbide and multi-gas etch processes that may contain a C-containing fluorinated GHG additive.
[75 FR 74818, Dec. 1, 2010, as amended at 78 FR 68225, Nov. 13, 2013]
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