40 CFR Subpart I
Electronics Manufacturing
June 9, 2020
§
98.97
Records that must be retained
§
98.98
Definitions
Table
I-1 to Subpart I of Part 98
Default Emission Factors for Threshold Applicability Determination
§
98.90
Definition of the source category
§
98.91
Reporting threshold
§
98.92
GHGs to report
§
98.93
Calculating GHG emissions
§
98.94
Monitoring and QA/QC requirements
§
98.95
Procedures for estimating missing data
§
98.96
Data reporting requirements
Table
I-2 to Subpart I of Part 98
Examples of Fluorinated GHGs Used by the Electronics Industry
Table
I-3 to Subpart I of Part 98
Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes
Table
I-4 to Subpart I of Part 98
Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 300 mm and 450 mm Wafer Size
Table
I-5 to Subpart I of Part 98
Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for MEMS Manufacturing
Table
I-6 to Subpart I of Part 98
Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for LCD Manufacturing
Table
I-7 To Subpart I of Part 98
Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for PV Manufacturing
Table
I-8 to Subpart I of Part 98
Default Emission Factors (1-UN2O,j) for N2O Utilization (UN2O,j)
Table
I-9 to Subpart I of Part 98
Methods and Procedures for Conducting Emissions Test for Stack Systems
Table
I-10 to Subpart I of Part 98
Maximum Field Detection Limits Applicable to Fluorinated GHG Concentration Measurements for Stack Systems
Table
I-11 to Subpart I of Part 98
Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for Use With the Stack Test Method (150 mm and 200 mm Wafers)
Table
I-12 to Subpart I of Part 98
Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for Use With the Stack Test Method (300 mm and 450 mm Wafers)
Table
I-13 to Subpart I of Part 98
Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for LCD Manufacturing for Use With the Stack Test Method
Table
I-14 to Subpart I of Part 98
Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for PV Manufacturing for Use With the Stack Test Method
Table
I-15 to Subpart I of Part 98
Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for MEMS Manufacturing for Use With the Stack Test Method
Table
I-16 to Subpart I of Part 98
Default Emission Destruction or Removal Efficiency (DRE) Factors for Electronics Manufacturing
Table
I-17 to Subpart I of Part 98
Expected and Possible By-Products for Electronics Manufacturinglg
Appendix
A to Subpart I of Part 98
Alternative Procedures for Measuring Point-of-Use Abatement Device Destruction or Removal Efficiency
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